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Dag Andersson

Akbari, Saeed, Kostov, Konstantin Stoychev, Lim, Jang-Kwon, Krishna Murthy, Hithiksha, Bakowski, Mietek, Wang, Qin, Salter, Michael, Andersson, Dag och Brinkfeldt, Klas, Fully printed ultrathin embedded electronics package for wide band gap power semiconductor devices using multimaterial inkjet additive manufacturing, Progress in Additive Manufacturing, 2025, 10 nr 9, s. 7241-, : Springer Science and Business Media Deutschland GmbH

Akbari, Saeed, Eng, Mattias P., Adolfsson, Erik, Kostov, Konstantin Stoychev, Wang, Qin, Amirpour, Sepideh, Thiringer, Torbjörn, Lim, Jang-Kwon, Bakowski, Mietek, Andersson, Dag och Kumar, Ashutosh, Vertically Aligned Graphene Layers as Thermal Interface Material for Gallium Nitride Semiconductor Components, Proc. – Int. Conf. Therm., Mech. Multi-Phys. Simul. Exp. Microelectron. Microsystems, EuroSimE, 2025, : Institute of Electrical and Electronics Engineers Inc.

Eng, Mattias P., Brinkfeldt, Klas, Svenningsson, Leo, Lövberg, Andreas och Andersson, Dag, Fingerprints – Active Monitoring of Degradation and Remaining Useful Life in the field, Proc. – Int. Conf. Therm., Mech. Multi-Phys. Simul. Exp. Microelectron. Microsystems, EuroSimE, 2025, : Institute of Electrical and Electronics Engineers Inc.

Eng, Mattias P., Mishra, Madhav, Söderkvist Vermelin, Wilhelm, Andersson, Dag och Brinkfeldt, Klas, A Link between the Lab and the Real World-A Setup for Accelerated Aging of Power Electronics Using Mission Profiles from the Field, 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024, 2024, : Institute of Electrical and Electronics Engineers Inc.

Söderkvist Vermelin, Wilhelm, Mishra, Madhav, Eng, Mattias P., Andersson, Dag och Kyprianidis, Konstantinos, Collaborative Training of Data-Driven Remaining Useful Life Prediction Models Using Federated Learning, International Journal of Prognostics and Health Management, 2024, 15 nr 2, : PHM Society

Akbari, Saeed, Holmberg, Jonas, Andersson, Dag, Mishra, Madhav och Brinkfeldt, Klas, Packaging Induced Stresses in Embedded and Molded GaN Power Electronics Components, Int. Conf. Therm., Mech. Multi-Phys. Simul. Exp. Microelectron. Microsyst., EuroSimE, 2023, : Institute of Electrical and Electronics Engineers Inc.

Akbari, Saeed, Kostov, Konstantin Stoychev, Brinkfeldt, Klas, Adolfsson, Erik, Lim, Jang-Kwon, Andersson, Dag, Bakowski, Mietek, Wang, Qin och Salter, Michael, Ceramic Additive Manufacturing Potential for Power Electronics Packaging, IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2022, 12 nr 11, s. 1857–1866, : Institute of Electrical and Electronics Engineers Inc.

Akbari, Saeed, Kostov, Konstantin Stoychev, Brinkfeldt, Klas, Bakowski, Mietek och Andersson, Dag, Low Inductive SiC Power Electronics Module with Flexible PCB Interconnections and 3D Printed Casing, 2022 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2022, 2022, : Institute of Electrical and Electronics Engineers Inc.

Sjöberg, Per-Olof, Edström, Adam, Andersson, Adam, Salter, Michael, Samel, Björn och Andersson, Dag, Sverige i halvledarvärlden – analys och förslag till strategi, 2022

Akbari, Saaed, Lövberg, Andreas, Tegehall, Per-Erik, Brinkfeldt, Klas och Andersson, Dag, Effect of PCB cracks on thermal cycling reliability of passive microelectronic components with single-grained solder joints, Microelectronics and reliability, 2019, 93, s. 61–71, : Elsevier BV

Brinkfeldt, Klas, Wetter, Göran, Lövberg, Andreas, Tegehall, Per-Erik, Andersson, Dag, Strandberg, Jan, Goncalves, Johnny, Söderlund, Jonas och Kwarnmark, Mikael, Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems, Journal of Electronic Packaging, 2019, 141 nr 3, : American Society of Mechanical Engineers (ASME)

Andersson, Dag, Grönqvist, Hans, Mayora, Kipa, Tijero, Maria, Voirin, Guy, Steinke, Arndt, Albrecht, Andreas, Wunscher, Heike, Frank, Thomas, Moore, Eric, Wang, Yineng, Cao, Xi, Vazquez, Patricia, Hogan, Anna, Belcastro, Marco, Billat, Sophie, Karmann, Stephan, Gunzler, Rainer och Weiler, Petra, Smart access to small lot manufacturing for systems integration, 2018 Pan Pacific Microelectronics Symposium, Pan Pacific 2018, 2018,, s. 1–9, : IEEE

Andersson, Dag, Tegehall, Per-Erik och Wetter, Göran, The impact of conformal coatings on the environmental protection of PCBassemblies and the reliability of solder joints, 2018

Brinkfeldt, Klas, Wetter, Göran, Lövberg, Andreas, Andersson, Dag, Toth-Pal, Zsolt, Forslund, Mattias och Shisha, Samer, Failure mechanism assessment of TO-247 packaged SiC power devices, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018, 2018, : American Society of Mechanical Engineers

Brinkfeldt, Klas, Wetter, Göran, Lövberg, Andreas, Tegehall, Per-Erik, Andersson, Dag, Goncalves, Johnny, Söderlund, Jonas, Strandberg, Jan och Kwarnmark, Mikael, Feasibility of PCB-integrated vibration sensors for condition monitoring of electronic systems, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018, 2018, : American Society of Mechanical Engineers

Karlsson, Helene, Lidström, Oscar, Grönqvist, Hans, Andersson, Dag, Wipenmyr, Jan och Hernandez, Niina, Quality assurance of encapsulation architecture, including subsequent washing process for permanently mounted wearable sensors, 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 2018,, s. 14–23, : IEEE

Lövberg, Andreas, Tegehall, Per-Erik, Akbari, Saeed och Andersson, Dag, On the formation and propagation of laminate cracks and their influence on the fatigue lives of solder joints, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018, 2018,, s. 1–13, : IEEE

Weiler, Petra, Steinke, Arndt, Andersson, Dag och Lanting, Cees J. M., Standardisation of smart systems building blocks : A requirement for a globally competitive cooperative foundry, 2018

Andersson, Dag, Weiler, Petra, Mayora, Kepa, Kunze, Michael, Günzler, Rainer, Karmann, Stephan, Steinke, Arndt, Winzer, Andreas, Thronicke, Nicole, Vazquez, Patricia, Felemban, Shifa, Moore, Eric, Voirin, Guy, Scolan, Emmanuel och Smadja, Rita, SMARTER-SI – Smart access to manufacturing for Systems Integration, 2017

Lövberg, Andreas, Tegehall, Per-Erik, Wetter, Göran, Brinkfeldt, Klas och Andersson, Dag, Simulations of the impact of single-grained lead-free solder joints on the reliability of ball Grid Array components, 2017

Andersson, Dag, Brinkfeldt, Klas, Nord, Stefan, Ottosson, Jonas, Lampic, Gorazd, Gotovac, Gorazd, Zschieschang, Olaf, Baumgartel, Hauke, Brusius, Matthias, Kaulfersch, Eberhard, Hilpert, Florian, Otto, Alexander och Frankeser, Sophia, COSIVU – Compact, smart and reliable drive unit for fully electric vehicles, 2016 Pan Pacific Microelectronics Symposium (Pan Pacific), 2016, : Institute of Electrical and Electronics Engineers Inc.

Brinkfeldt, Klas, Ottosson, Jonas, Neumaier, Klaus, Zschieschang, Olaf, Kaulfersch, Eberhard, Edwards, Michael, Otto, Alexander och Andersson, Dag, Design and Fabrication of a SiC-Based Power Module with Double-Sided Cooling for Automotive Applications, Lecture Notes in Mobility och Advanced Microsystems for Automotive Applications 2015, 2016,, s. 157–171, s. 157–172 och, s. 157–171, s. 157–172, Cham : Springer International Publishing och Cham : Springer International Publishing

Brinkfeldt, Klas, Ottosson, Jonas, Otto, Alex, Mann, Alexander, Zschieschang, Olaf, Frankeser, Sophia och Andersson, Dag, Thermal Simulations and Experimental Verification of Power Modules Designed for Double Sided Cooling, Electronic Components and Technology, 2016,, s. 1415–1422, : Institute of Electrical and Electronics Engineers Inc.

Andersson, Dag, Nilsson, Erik och Wetter, Göran, Interconnection of electrically conductive fibersfor application in smart textiles, 2015

Andersson, Dag och Brinkfeldt, Klas, Simulations and Fabrication of a SiC-Based Power Module with Double SidedCooling : in Proceedings of the IMAPS Nordic Annual Conference 2015, 2015